Discussion
After the photoresist pattern is formed, which of the process is followed :
Answer: C
After the photoresist pattern is formed, the next process is etching.
In photolithography the resist is coated, exposed through a mask and developed, leaving a pattern of resist on the wafer. That pattern then serves as a mask: etching removes the exposed underlying layer, such as silicon dioxide or metal, while the resist protects the covered areas. The resist is stripped afterwards.
Oxidation is done before the resist is applied, to grow the layer that will be patterned. Masking is what the exposure step already did with the photomask. Bonding comes at the packaging stage, long after the wafer has been patterned.
No comment is present. Be the first to comment.
Loading…
Post your comment
Please log in or register to post a comment.
Examination Categories
- SSC Exams
- Banking Exams
- Teaching Exams
- Civil Services Exams
- Railways Exams
- Engineering Recruitment Exams
- Defence Exams
- State Government Exams
- Police Exams
- Insurance Exams
- Nursing Exams
- Other Government Exams
- NRA CET
- PG Entrance Exams
- Campus Placement
- MBA Entrance Exams
- CUET and UG Entrance
- Judiciary Exams
- Regulatory Body Exams
- Software Development