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The process of selectively removing certain protective regions from the surface of a substrate is known as :

  • A.Epitaxy
  • B.Lithography
  • C.Metalization
  • D.Bonding

Answer: B

The process is lithography.

In integrated circuit fabrication, photolithography transfers a pattern from a mask to the wafer: a photoresist layer is exposed through the mask and developed, and the uncovered regions of the protective oxide are then etched away. This selective removal of protective regions opens windows for diffusion, implantation or contacts.

Epitaxy grows a new crystal layer on the substrate. Metalization deposits metal for interconnections. Bonding attaches wires from the chip to the package leads. None of these removes protective regions selectively.

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