Discussion
Match List I with List II and select the correct answer using codes given below.
| List I | List II |
|---|---|
| (a) Ion Implantor | (i) Photolithography |
| (b) CVD Reactor | (ii) Conductor and directric film deposition |
| (c) UV Exposure | (iii) Bonding |
| (d) Pad to pin connection | (iv) Doping |
Answer: C
The correct matching is a-iv, b-ii, c-i, d-iii.
- An ion implanter accelerates dopant ions into the wafer, so it is used for doping (iv).
- A CVD reactor deposits thin films, conducting and dielectric (printed 'directric'), from gas-phase reactions (ii).
- UV exposure transfers the mask pattern to photoresist in photolithography (i).
- Pad to pin connection is made by wire bonding (iii).
The other codes send UV exposure to film deposition or the ion implanter to photolithography, which mixes up the patterning step with the doping and deposition steps it prepares for.
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