Discussion
Which is the final step in wafer processing sequence ?
Answer: C
The final step is metallization.
Wafer processing runs through oxidation, photolithography, etching, diffusion or ion implantation and deposition, repeated for each layer that builds the transistors. Only when the devices are complete is a metal layer, usually aluminium or copper, deposited and patterned to form the contacts and interconnections between them, followed by passivation.
Oxidation and photolithography come early and are repeated throughout, and chemical vapour deposition is used for intermediate layers, so none of them is the last step.
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