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A design to be hand-assembled in small numbers should avoid

  • A.dual in line packages in a socket
  • B.ball grid array packages
  • C.quad flat packages with a 0.5 mm pitch
  • D.small outline packages with gull-wing leads

Answer: B

Balls under the body cannot be reached with an iron or inspected visually, so a BGA needs a reflow oven and X-ray inspection. Fine-pitch leaded packages are difficult but possible by hand, and leads can at least be seen.

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