Discussion
Match the package with its characteristic.
1. DIP 2. QFN 3. BGA
P. Connections beneath the body on a grid Q. Through-hole and socketable R. Leadless pads on the underside edge
Answer: A
The three represent three eras and three assembly requirements: a socket and an iron, a reflow oven with a good stencil, and a full surface-mount line with X-ray inspection. The choice constrains who can build the board.
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