Discussion
Consider the following statements about thermal design.
1. Junction, interface and heatsink resistances add in series
2. Thermal compound reduces the interface resistance
3. A larger heatsink reduces the junction-to-case resistance
Which of the statements given above is or are correct?
Answer: C
The first two are correct and the third confuses the terms: a heatsink reduces only its own resistance to the air, while the junction-to-case path is fixed inside the package. Since the terms add, improving one has diminishing value once it has fallen below the others, which is why an ever larger sink eventually buys nothing. Naming which term a remedy acts on is what makes thermal design systematic.
Post your comment
Please log in or register to post a comment.
Examination Categories
- SSC Exams
- Banking Exams
- Teaching Exams
- Civil Services Exams
- Railways Exams
- Engineering Recruitment Exams
- Defence Exams
- State Government Exams
- Police Exams
- Insurance Exams
- Nursing Exams
- Other Government Exams
- NRA CET
- PG Entrance Exams
- Campus Placement
- MBA Entrance Exams
- CUET and UG Entrance
- Judiciary Exams
- Regulatory Body Exams
- Software Development