Discussion
Which of the following would not reduce an output device's junction temperature?
Raising the ambient temperature around the equipment
Fitting a larger heatsink
Applying thermal compound at the interface
Reducing the power the device dissipates
Answer: C
Raising the ambient raises the junction temperature directly, since the junction sits at ambient plus the rise. The other three all reduce either the rise or the starting point. Because the junction temperature is a sum of an ambient and a rise, both terms have to be considered - and equipment that works on a bench can fail in a warm rack for exactly this reason.
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